Web2) “ Dry Etching of Copper Using Plasma” by Kejun Xia Semiconductor TCAD Lab. Auburn University, AL, Oct 19, 2003 3)“Plasma etching of copper films at low temperature” P.A.Tamirisa et al , Microelectronic Engineering, Volume 84, Issue 1, January 2007, Pages 105–108 A Joshi Reactive Ion Etching, RD51 Collaboration 26 WebAug 21, 2000 · The paper presents the results of investigations of the structure and corrosion resistance of chromium nitride, oxynitride and oxide layers produced on …
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WebOverview. P5000 is a load-locked, magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is ainly ... WebMar 18, 2024 · Chromium oxynitride (CrOXNY) as electrode material is not yet been explored for SC applications. In this context, we have carried out the systematic study of the nanostructured nano-spherical CrOXNYnanoparticle … the watcher by margaret widdemer
Buffered oxide etch - Wikipedia
All reagents and chemicals are used without further purification. N-methyl-2-pyrrolidone (NMP), potassium hydroxide (KOH) pellets, acetylene black, poly (vinylidene fluoride) … See more The working electrodes are prepared according to the following method. Active material CrON nanoparticles (80 wt%), PVDF (5 wt%), and acetylene black (15 wt%) are grounded well, and the slurry ink is prepared using … See more Synthesis of CrON nanoparticle is reported earlier by our group in the context of supercapacitor application [30]. In brief, chromium chloride … See more X-ray diffraction (XRD) of powder samples are measured on Bruker D8 Discover AXS powder x-ray diffractometer with high intensity of Cu Kαradiation source (1.5418 Å) in a 2θ range from 10° to 90°.The … See more WebMethods for etching chromium and forming a photomask using a carbon hard mask are provided. In one embodiment, a method of a chromium layer includes providing a substrate in a processing chamber, the substrate having a chromium layer partially exposed through a patterned carbon hard mask layer, providing a process gas containing chlorine and … WebThe target was chromium (purity: 99.9%) and 88mm wide, 200mm long, and 5mm thick. The sputtering gas was Ar and the reactive gas was N2. These gases were supplied to a chamber through two mass flow controllers. Subseqently, these gases were mixed and passed through an ion source booster for ionization. Before deposition, the chamber was the watcher book true story